Title:
METAL CONTAINERS FOR SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO2006089032
Kind Code:
B1
Abstract:
A container for soldering adjuvant is made of a metal having a composition similar to the composition of a solder bath. Preferably, the container holds solder paste and the container is made of metal having a composition similar to the composition of the metal part of the paste in the container. Exemplary alloys from which the container is made include 2.5 to 5% silver, up to 2% copper and a balance of tin; and a lead-tin eutectic composition.
Inventors:
KAY LAWRENCE C (US)
Application Number:
PCT/US2006/005494
Publication Date:
December 14, 2006
Filing Date:
February 15, 2006
Export Citation:
Assignee:
P KAY METAL INC (US)
KAY LAWRENCE C (US)
KAY LAWRENCE C (US)
International Classes:
B23K1/005; B23K3/04; B23K35/14
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