Title:
METAL ELECTROPLATING COMPOSITION FOR ELECTROLYTIC COPPER COATING AND USE METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/046447
Kind Code:
A1
Abstract:
The present invention provides a metal electroplating composition used for electrolytic copper coating, comprising a chip copper interconnect electroplating additive,
the chip copper interconnect electroplating additive being selected from the compounds of formula I to formula V, R1, R2 and R3 being selected from alkyl or aralkyl, R4 being selected from hydrogen or a C1 to C4 alkyl, k being any integer from 1 to 10, and n being any integer from 1 to 20. Using the described technical solution, it is possible to achieve technical effects such as the absence of holes and defects, low impurities in the coating, excellent uniformity in plating, a dense structure, and low surface roughness. The metal electroplating composition may exhibit good thermal reliability and uniform plating capability, and is capable of addressing the issue of pore sealing, thereby exhibiting significant industrial application value.
Inventors:
SUN PENG (CN)
PENG HONGXIU (CN)
SHEN MENGHAN (CN)
PENG HONGXIU (CN)
SHEN MENGHAN (CN)
Application Number:
PCT/CN2023/116385
Publication Date:
March 07, 2024
Filing Date:
September 01, 2023
Export Citation:
Assignee:
NINGBO ANJI MICROELECTRONICS TECH CO LTD (CN)
International Classes:
C25D3/38; C25D3/02; C25D7/12
Foreign References:
| CN108350590A | 2018-07-31 | |||
| GB1199494A | 1970-07-22 | |||
| CN112760683A | 2021-05-07 | |||
| CN108026656A | 2018-05-11 | |||
| CN1733978A | 2006-02-15 | |||
| TW201305395A | 2013-02-01 | |||
| US20190367522A1 | 2019-12-05 | |||
| CN114277413A | 2022-04-05 |
Attorney, Agent or Firm:
BEIJING DACHENG LAW OFFICES, LLP (CN)
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