Title:
METAL FILM AND SPUTTERING TARGET
Document Type and Number:
WIPO Patent Application WO/2020/116545
Kind Code:
A1
Abstract:
The present invention contains 0.05 to 5.00 at% of In, and the Pd content is 40 ppm by mass or less, the Pt content is 20 ppm by mass or less, the Au content is 20 ppm by mass or less, the Rh content is 10 ppm by mass or less, and the combined content of Pd, Pt, Au and Rh is 50 ppm or less by mass, the balance being Ag and inevitable impurities.
Inventors:
TOSHIMORI YUTO (JP)
NONAKA SOHEI (JP)
KOMIYAMA SHOZO (JP)
HAYASHI YUJIRO (JP)
NONAKA SOHEI (JP)
KOMIYAMA SHOZO (JP)
HAYASHI YUJIRO (JP)
Application Number:
PCT/JP2019/047544
Publication Date:
June 11, 2020
Filing Date:
December 05, 2019
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C23C14/14; C22C5/06; C23C14/34; G02F1/1335; G02F1/1343; C22F1/00; C22F1/14
Domestic Patent References:
| WO2016136590A1 | 2016-09-01 |
Foreign References:
| JP2017088984A | 2017-05-25 | |||
| JP2017031503A | 2017-02-09 | |||
| JP2018228366A | 2018-12-05 | |||
| JP2006028641A | 2006-02-02 | |||
| JPS6020750B2 | 1985-05-23 | |||
| JP2017179594A | 2017-10-05 | |||
| JP2017183274A | 2017-10-05 |
Other References:
See also references of EP 3892751A4
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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