Title:
METAL FOIL, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2023/016061
Kind Code:
A1
Abstract:
The present invention relates to the technical field of metal foils. Disclosed is a metal foil, comprising a conductive layer and a bearing layer, the conductive layer and the bearing layer being stacked. The conductive layer is used for manufacturing a conductive circuit; when the circuit board is manufactured using the metal foil, the bearing layer is separated from the conductive layer by means of a first etching solution, and the roughness Rz of the surface of the bearing layer close to the conductive layer is smaller than or equal to 2 microns; when the circuit board is manufactured using the metal foil, the surface of the conductive circuit is substantially flush with the surface of a substrate after the bearing layer is removed, and the surface roughness of the conductive circuit is low, such that the product requirement having high dimensional accuracy can be satisfied. Moreover, embodiments of the present invention further correspondingly provide a circuit board and a method for manufacturing the circuit board.
Inventors:
ZHANG MEIJUAN (CN)
ZHU YUHUA (CN)
ZHU YUHUA (CN)
Application Number:
PCT/CN2022/095914
Publication Date:
February 16, 2023
Filing Date:
May 30, 2022
Export Citation:
Assignee:
GUANGZHOU FANGBANG ELECTRONICS CO LTD (CN)
International Classes:
H05K1/09; H05K1/11
Foreign References:
| CN113811093A | 2021-12-17 | |||
| JP2003011267A | 2003-01-15 | |||
| JP2020088062A | 2020-06-04 | |||
| CN108701656A | 2018-10-23 | |||
| CN105746003A | 2016-07-06 | |||
| CN105472883A | 2016-04-06 | |||
| JP2004228108A | 2004-08-12 |
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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