Title:
METAL FOIL WITH CARRIER FOIL, LAMINATE FOR PRINTED WIRING BOARD USING SAME, AND MANUFACTURING METHOD FOR LAMINATE
Document Type and Number:
WIPO Patent Application WO/2023/277462
Kind Code:
A1
Abstract:
The present invention relates to a metal foil with a carrier foil, a laminate for a printed wiring board manufactured using the metal foil with a carrier foil, and a manufacturing method for the laminate for a printed wiring board. The metal foil with a carrier foil comprises: a carrier foil; a release layer provided on the carrier foil and containing at least one selected from the group consisting of titanium, copper, nickel, and aluminum; and a metal layer provided on the release layer and formed by electroless plating.
Inventors:
CHUN SUNG WOOK (KR)
CHUNG BO MOOK (KR)
PARK MYONG WHAN (KR)
CHUNG BO MOOK (KR)
PARK MYONG WHAN (KR)
Application Number:
PCT/KR2022/009044
Publication Date:
January 05, 2023
Filing Date:
June 24, 2022
Export Citation:
Assignee:
YMT CO LTD (KR)
International Classes:
H05K1/09; C23C18/40; C23C28/02; H05K3/00; H05K3/18
Foreign References:
| KR20170104648A | 2017-09-15 | |||
| KR20140112405A | 2014-09-23 | |||
| KR20160088824A | 2016-07-26 | |||
| KR20180114533A | 2018-10-18 | |||
| KR20160133164A | 2016-11-22 | |||
| KR20130082320A | 2013-07-19 |
Attorney, Agent or Firm:
KWAK, Hyun Kyu (KR)
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