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Patent Searching and Data


Title:
METAL INTEGRAL LED HEAT DISSIPATION STRUCTURE FOR ILLUMINATION AND BACKLIGHT
Document Type and Number:
WIPO Patent Application WO/2012/024867
Kind Code:
A1
Abstract:
A metal integral LED heat dissipation structure for illumination and backlight is provided, which includes a lamp cap (1), a lamp cup body (2), a circuit board (3) on which an LED is mounted and a lamp globe (4); the lamp cap (1) is fixed with one side of the lamp cup body (2) by an insulating plastic shell, and the lamp globe (4) is fixed with the other side of the lamp cup body (2); the circuit board (3) is connected with the lamp cup body (2); the lamp cup body (2) is an integral structure made of aluminum materials; the surface of the circuit board (3) connected with the lamp cup body (2) is an aluminum foil or an aluminum plate layer; the outer surface of the aluminum foil or aluminum plate layer is coated with a first metal layer; an aluminum installation plane is set on the surface of the lamp cup body (2) connected with circuit board (3), the outer surface of the aluminum installation surface is coated with a second metal layer; the first metal layer on the aluminum foil or aluminum plate layer of the circuit board (3) is welded with the second metal layer of the lamp cup body (2) by solder paste. The invention enables the metal integral structure, and greatly improves the heat dissipation performance of the LED lamp, and can effectively control the heating temperature of the LED lamp.

Inventors:
CHEN NUOCHENG (CN)
Application Number:
PCT/CN2010/079056
Publication Date:
March 01, 2012
Filing Date:
November 24, 2010
Export Citation:
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Assignee:
HUIGENG ELECTRONIC IND CO LTD (CN)
CHEN NUOCHENG (CN)
International Classes:
F21V29/00
Foreign References:
CN201507806U2010-06-16
CN201507806U2010-06-16
CN101076224A2007-11-21
CN201100532Y2008-08-13
US20070230182A12007-10-04
Attorney, Agent or Firm:
SHOUCHUANG JUNHE PATENT AGENT CO., LTD. XIAMEN (CN)
厦门市首创君合专利事务所有限公司 (CN)
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Claims: