Title:
METAL LAMINATE, METHOD FOR MANUFACTURING SAME, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/074531
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a metal laminate that exhibits both high cycle characteristics and high adhesiveness at a lamination interface. The present invention relates to: a metal laminate in which a metal layer formed from at least one metal-foil-including layer is laminated on at least one surface of a low-dielectric film, a plurality of protrusions of the metal foil being formed on the low-dielectric-film-side surface of the metal foil, and the sum of the average value of b/a and 3σ (in this expression, σ is the standard deviation of b/a) being 2.5 or less, where a is the width of the protrusions and b is the height of the protrusions, and the peel strength of the metal layer with respect to the low-dielectric film is 3N/cm or greater; a method for manufacturing the metal laminate; and a printed wiring board.
Inventors:
NANBU KOUJI (JP)
HATAKEDA TAKAFUMI (JP)
MARUHASHI YOSHIKAZU (JP)
KUROKAWA TEPPEI (JP)
HATAKEDA TAKAFUMI (JP)
MARUHASHI YOSHIKAZU (JP)
KUROKAWA TEPPEI (JP)
Application Number:
PCT/JP2022/039148
Publication Date:
May 04, 2023
Filing Date:
October 20, 2022
Export Citation:
Assignee:
TOYO KOHAN CO LTD (JP)
International Classes:
B32B15/08; B32B15/01; C23C26/00; H05K3/00; H05K3/38
Domestic Patent References:
| WO2008146448A1 | 2008-12-04 |
Foreign References:
| JP2021035755A | 2021-03-04 | |||
| JP2002113811A | 2002-04-16 | |||
| JP2019162661A | 2019-09-26 |
Attorney, Agent or Firm:
HIRAKI & ASSOCIATES (JP)
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