Title:
METAL LAMINATE MOLDING FLOW PATH MEMBER AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/131379
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a metal laminate molding flow path member having levels of both surface roughness and corrosion resistance within the flow path that make possible use thereof as a flow path member used for a corrosive fluid supply line of a semiconductor device manufacturing apparatus. A metal laminate molding flow path member according to the present invention is one through which a corrosive fluid passes, and is characterized in that: a metal base body for forming the same has an uneven surface; the inner surface of the flow path of the metal laminate molding flow path member is formed with a glass coating layer so as to fill in at least the recessed regions of the uneven surface of the metal base body; and the glass coating layer includes at least one layer of a P2O5-ZnO-Al2O3 glass layer, a Bi2O3-ZnO-B2O3 glass layer, and a SiO2-B2O3-Na2O glass layer.
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Inventors:
MIYATA MOTOYUKI (JP)
AOYAGI TAKUYA (JP)
DAIGO YUZO (JP)
MIYAKE TATSUYA (JP)
NAITO TAKASHI (JP)
AOYAGI TAKUYA (JP)
DAIGO YUZO (JP)
MIYAKE TATSUYA (JP)
NAITO TAKASHI (JP)
Application Number:
PCT/JP2020/042272
Publication Date:
July 01, 2021
Filing Date:
November 12, 2020
Export Citation:
Assignee:
HITACHI METALS LTD (JP)
International Classes:
B22F3/16; B22F3/105; B22F3/24; B22F5/10; B22F5/12; B33Y10/00; B33Y80/00; C03C8/16; C23C26/00; F16L9/02; F16L9/14; F16L58/14; H01L21/304; H01L21/3065
Foreign References:
| JP2011219325A | 2011-11-04 | |||
| JPS6159087A | 1986-03-26 | |||
| JP2014113610A | 2014-06-26 | |||
| JP2013256437A | 2013-12-26 | |||
| JPH07281759A | 1995-10-27 | |||
| JP2018170205A | 2018-11-01 |
Other References:
See also references of EP 4082694A4
Attorney, Agent or Firm:
POLAIRE I.P.C. (JP)
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