Title:
METAL LAYER AND ELECTROMAGNETIC-WAVE-SHIELDING FILM
Document Type and Number:
WIPO Patent Application WO/2021/177138
Kind Code:
A1
Abstract:
Provided is a metal layer for an electromagnetic-wave-shielding film, with which the interlayer adhesion of the electromagnetic-wave-shielding film can be made resistant to breakdown due to volatile components. This metal layer for an electromagnetic-wave-shielding film has a first main surface and a second main surface on the opposite side from the first main surface, the metal layer being characterized in that a plurality of openings passing from the first main surface to the second main surface are formed in the metal layer, the opening area of the openings in the first main surface is 70-71,000 µm2, the opening proportion of the openings in the first main surface is 0.1-20%, and the opening area of the openings in the second main surface is greater than the opening area of the openings in the first main surface.
Inventors:
KAMINO KENJI (JP)
Application Number:
PCT/JP2021/007150
Publication Date:
September 10, 2021
Filing Date:
February 25, 2021
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
H05K9/00; B32B15/08; H05K1/02
Domestic Patent References:
| WO2018147298A1 | 2018-08-16 | |||
| WO2018168786A1 | 2018-09-20 |
Foreign References:
| JP2009243138A | 2009-10-22 | |||
| JP6860111B1 | 2021-04-14 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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