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Patent Searching and Data


Title:
METAL MOLD FOR FORMING LAMINATED MOLDING AND METHOD OF MANUFACTURING LAMINATED MOLDING
Document Type and Number:
WIPO Patent Application WO/1999/046106
Kind Code:
A1
Abstract:
A metal mold (1) for forming a laminated molding obtained by laminating compressible surface materials on a molded product main body, wherein positioning pins (112, 134) for positioning the surface materials are installed so that they can be retractable into a cavity (10A) in a metal mold main body (10), whereby the positional displacement of the surface materials can be prevented securely because the surface materials can be positioned and held accurately and easily, and the effect by the positioning pins (112, 134) is eliminated by keeping the positioning pins (112, 134) retracted before molten resin is solidified so as to provide the laminated molding having an excellent quality and appearance.

Inventors:
SAITO YOSHIAKI (JP)
ABE TOMOKAZU (JP)
FUKUSHIMA TERUNOBU (JP)
Application Number:
PCT/JP1999/001172
Publication Date:
September 16, 1999
Filing Date:
March 11, 1999
Export Citation:
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Assignee:
IDEMITSU PETROCHEMICAL CO (JP)
SANWAKAKO CO LTD (JP)
SAITO YOSHIAKI (JP)
ABE TOMOKAZU (JP)
FUKUSHIMA TERUNOBU (JP)
International Classes:
B29C33/12; B29C45/14; B29C45/26; (IPC1-7): B29C45/26; B29C33/14; B29C45/14
Foreign References:
JPH08267504A1996-10-15
JPH058251A1993-01-19
JPH10309721A1998-11-24
Attorney, Agent or Firm:
Kinoshita, Jitsuzo (Ogikubo 5-chome Suginami-ku Tokyo, JP)
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