Title:
METAL WIRING HAVING EXCELLENT BENDING RESISTANCE, CONDUCTIVE SHEET, AND METAL PASTE FOR FORMING SAID METAL WIRING
Document Type and Number:
WIPO Patent Application WO/2022/004629
Kind Code:
A1
Abstract:
The present invention pertains to metal wiring that is formed on a flexible substrate and that is formed of a sintered body of silver particles. The sintered body forming the metal wiring is characterized by having a volume resistivity of at most 20 μΩ·cm, a hardness of at most 0.38 GPa, and a Young's modulus of at most 7.0 GPa. A conductive sheet provided with the metal wiring can be produced by applying and baking, on a substrate, a metal paste containing, as a solid content, silver particles that has a predetermined particle size and particle size distribution, and containing, as an adjusting agent, an ethyl cellulose having a number-average molecular weight of 10,000-90,000. The metal wiring according to the present invention has excellent bending resistance because the electrical characteristics of the metal wiring is inhibited from being changed even when the metal wiring is repeatedly subjected to bending deformation.
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Inventors:
SATO HIROKI (JP)
OHSHIMA YUUSUKE (JP)
OOTAKE SHIGEYUKI (JP)
OHSHIMA YUUSUKE (JP)
OOTAKE SHIGEYUKI (JP)
Application Number:
PCT/JP2021/024293
Publication Date:
January 06, 2022
Filing Date:
June 28, 2021
Export Citation:
Assignee:
TANAKA PRECIOUS METAL IND (JP)
International Classes:
B22F1/00; B22F9/00; C22C1/04; G06F3/041; H01B1/22; H01B5/14; H05K1/09
Domestic Patent References:
| WO2017033911A1 | 2017-03-02 |
Foreign References:
| JP2014006865A | 2014-01-16 | |||
| JP2019145817A | 2019-08-29 |
Attorney, Agent or Firm:
TANAKA AND OKAZAKI (JP)
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