Title:
METALIZED FILM AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2018/179904
Kind Code:
A1
Abstract:
To provide a metalized film with which it is possible to form a flat and smooth thin copper film on a flat and smooth fluorine resin using a physical vapor deposition method and to ensure adhesion strength between the fluorine resin and the copper film by selecting, as appropriate, the type of physical vapor deposition method, so as to enable formation of wiring. Provided is a metalized film with which it is possible to: keep the thickness of a metal film obtained by means of sputtering to a minimum level; conduct electrolytic plating when combined with a vacuum deposition method; and form wiring in which stable adhesion strength is achieved.
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| JPS6119898 | PRODUCTION OF VAPOR DEPOSITED PAPER |
Inventors:
FUJI NOBUO (JP)
TSUJI TERUAKI (JP)
TSUJI TERUAKI (JP)
Application Number:
PCT/JP2018/004601
Publication Date:
October 04, 2018
Filing Date:
February 09, 2018
Export Citation:
Assignee:
TORAY KP FILMS INC (JP)
International Classes:
C23C14/20; B32B15/082; C23C14/02; C23C14/06; C23C14/14; C23C28/02; C25D5/56; C25D7/00; H05K1/03
Domestic Patent References:
| WO2009096124A1 | 2009-08-06 |
Foreign References:
| JP2007173818A | 2007-07-05 | |||
| JP2003283099A | 2003-10-03 | |||
| JP2004006668A | 2004-01-08 | |||
| JP4646580B2 | 2011-03-09 | |||
| JP2010163654A | 2010-07-29 | |||
| JP2006049892A | 2006-02-16 | |||
| JP2013147701A | 2013-08-01 |
Attorney, Agent or Firm:
ICHIJO, Chikara (JP)
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