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Title:
METALLIC COPPER PARTICLES, AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2016/031860
Kind Code:
A1
Abstract:
Provided are: metallic copper particles exhibiting excellent low-temperature sintering properties at temperatures equal to or lower than 300˚C; and a production method therefor. In these metallic copper particles, metallic copper fine particles are adhered to the surfaces of large-diameter metallic copper particles. With regard to the metallic copper particles to be produced, copper oxide and hypophosphoric acid and/or a salt thereof are mixed and reduced, preferably in the presence of 1-500 mass% of gelatin and/or collagen peptide. The reduction reaction temperature is preferably in the range of 20-100˚C. The produced metallic copper particles have a volume resistivity value when heated to a temperature of 300˚C under a nitrogen atmosphere of 1×10-2 Ω∙cm or less.

Inventors:
IDA KIYONOBU (JP)
WATANABE MITSURU (JP)
TOMONARI MASANORI (JP)
Application Number:
PCT/JP2015/074025
Publication Date:
March 03, 2016
Filing Date:
August 26, 2015
Export Citation:
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Assignee:
ISHIHARA SANGYO KAISHA (JP)
International Classes:
B22F9/20; B22F1/052; B22F1/102; B22F1/105; B22F1/17; H01B1/00; H01B1/22; H01B5/00; H01B13/00; B22F1/06; B22F1/068
Domestic Patent References:
WO2009116349A12009-09-24
WO2010032841A12010-03-25
WO2012161201A12012-11-29
WO2010024385A12010-03-04
Foreign References:
JP2013064191A2013-04-11
Other References:
See also references of EP 3187288A4
Attorney, Agent or Firm:
ASAMURA PATENT OFFICE, p. c. (JP)
Patent business corporation Asamura patent firm (JP)
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