Title:
METALLIC MATERIAL FOR ELECTRONIC COMPONENT, CONNECTOR TERMINAL OBTAINED USING SAME, CONNECTOR, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2013/140850
Kind Code:
A1
Abstract:
Provided are a metallic material for electronic components which is low in insertion/pulling-out force, generates few whiskers, and has high durability and a connector terminal, a connector, and an electronic component which are obtained using the metallic material. The metallic material for electronic components comprises a base, a lower layer formed on the base and constituted of one or more elements selected from the group consisting of Ni, Cr, Mn, Fe, Co, and Cu, and an upper layer formed on the lower layer and constituted of an alloy of Sn and/or In (constituent element A) with one or more of Ag, Au, Pt, Pd, Ru, Rh, Os, and Ir (constituent element B), wherein the lower layer has a thickness of 0.05 µm or larger, the upper layer has a thickness of 0.005-0.6 µm, and the upper layer satisfies the following relationship between (constituent element A)/[(constituent element A)+(constituent element B)] [mass%] (hereinafter, referred to as proportion of (Sn+In)) and the coating thickness [µm].
Coating thickness ≤ 8.2×[proportion of (Sn+In)]-0.66 [wherein proportion of (Sn+In) ≥ 10 mass%]
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Inventors:
SHIBUYA YOSHITAKA (JP)
FUKAMACHI KAZUHIKO (JP)
KODAMA ATSUSHI (JP)
FUKAMACHI KAZUHIKO (JP)
KODAMA ATSUSHI (JP)
Application Number:
PCT/JP2013/051633
Publication Date:
September 26, 2013
Filing Date:
January 25, 2013
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C23C28/02; C22C5/02; C22C5/04; C22C5/06; C22C5/08; C22C5/10; C22C9/00; C22C9/02; C22C9/04; C22C9/05; C22C9/06; C22C13/00; C22C13/02; C22C19/03; C22C19/07; C22C22/00; C22C27/06; C22C28/00; C22C38/00; C23C14/14; H01B1/02; H01B5/02; H01B7/00; H01R13/03; H05K1/09
Foreign References:
JPH11279792A | 1999-10-12 | |||
JPH11350189A | 1999-12-21 | |||
JP2012036436A | 2012-02-23 | |||
JP2001053210A | 2001-02-23 | |||
JP2010265540A | 2010-11-25 | |||
JPH04370613A | 1992-12-24 | |||
JPH11350189A | 1999-12-21 |
Other References:
See also references of EP 2829637A4
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
Axis international patent business corporation (JP)
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