Title:
(METH)ACRYLATE RESIN HAVING ACID GROUP, CURABLE RESIN COMPOSITION, CURED PRODUCT, INSULATING AMTERIAL AND RESIST MEMBER
Document Type and Number:
WIPO Patent Application WO/2022/107508
Kind Code:
A1
Abstract:
The present invention provides a (meth)acrylate resin having an acid group, said (meth)acrylate resin using, as essential starting materials, (A) an epoxy resin, (B) an unsaturated monobasic acid, (C) a compound having a hydroxyl group and a carboxyl group, and (D) a polybasic acid anhydride, while being characterized in that: the compound (C) has at least two hydroxyl groups and at least one carboxyl group; and the amount of the compound (C) used is within the range of from 0.2 mole to 0.4 mole relative to 1 mole of epoxy groups in the epoxy resin (A). Since this (meth)acrylate resin having an acid group has excellent alkali developability and a cured product thereof has excellent elongatability and adhesion to a base material, this (meth)acrylate resin having an acid group is suitable for use in insulating materials, resist members and the like.
Inventors:
YAMADA SHUNSUKE (JP)
KAMEYAMA HIROFUMI (JP)
KAMEYAMA HIROFUMI (JP)
Application Number:
PCT/JP2021/037986
Publication Date:
May 27, 2022
Filing Date:
October 14, 2021
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08F290/14; C08G59/14; G03F7/027; H01B3/44
Domestic Patent References:
| WO2020059500A1 | 2020-03-26 |
Foreign References:
| JP2014115365A | 2014-06-26 | |||
| JP2005115187A | 2005-04-28 | |||
| JPH06256441A | 1994-09-13 | |||
| JPH06324490A | 1994-11-25 | |||
| JP2000214584A | 2000-08-04 | |||
| JP2002040647A | 2002-02-06 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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