Title:
METHOD FOR ADHERING THIN FILM, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/021447
Kind Code:
A1
Abstract:
A method for adhering a thin film (2), and an electronic device. The adhering method comprises: providing a hard tool (1), a thin film (2) and an accessory (3) to be adhered, the hard tool (1) comprising a working surface (11); bonding the thin film (2) to the working surface (11); moving the working surface (11) of the hard tool (1) towards said accessory (3), so that the thin film (2) bonded on the working surface (11) is bonded with said accessory (3); and peeling the working surface (11) of the hard tool (1) from the thin film (2). Compared with an adhering mode of directly adhering the soft thin film (2) to said accessory (3), according to the adhering method, the adhering difficulty of the thin film (2) can be reduced and the adhering yield of the thin film (2) can be improved.
Inventors:
WU WENLONG (CN)
Application Number:
PCT/CN2022/139388
Publication Date:
February 01, 2024
Filing Date:
December 15, 2022
Export Citation:
Assignee:
WUXI WINGTECH INFORMATION TECH CO LTD (CN)
International Classes:
B29C65/48; B29L31/34
Foreign References:
| CN115256963A | 2022-11-01 | |||
| CN216102985U | 2022-03-22 | |||
| CN202624765U | 2012-12-26 | |||
| CN112550876A | 2021-03-26 | |||
| CN206242647U | 2017-06-13 | |||
| CN104898309A | 2015-09-09 | |||
| CN114083790A | 2022-02-25 | |||
| CN202464192U | 2012-10-03 | |||
| KR20180068809A | 2018-06-22 |
Attorney, Agent or Firm:
GUANGZHOU DEKE INTELLECTUAL PROPERTY AGENT LTD. (CN)
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