Title:
METHOD FOR ANALYZING PHOTOSENSITIVE COMPOSITION, METHOD FOR MANUFACTURING PHOTOSENSITIVE COMPOSITION, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/053838
Kind Code:
A1
Abstract:
Provided are a method for analyzing a photosensitive composition, a method for manufacturing a photosensitive composition, and a method for manufacturing an electronic device, with which it is possible for a trace amount of metal atoms contained in the photosensitive composition to be easily detected. This method for analyzing a photosensitive composition includes: a step 1 for forming a coating film by applying the photosensitive composition onto a substrate; a step 2 for obtaining a substrate from which the coating film has been removed, by removing the coating film from the substrate without exposing the coating film to light; and a step 3 for obtaining a measured value by employing total reflection X-ray fluorescence analysis to measure a number of metal atoms per unit area on the substrate from which the coating film has been removed.
Inventors:
NAGASAKI HIDEO (JP)
KAMIMURA TETSUYA (JP)
KAMIMURA TETSUYA (JP)
Application Number:
PCT/JP2022/032965
Publication Date:
April 06, 2023
Filing Date:
September 01, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G01N23/223; G03F7/038; G03F7/039; G03F7/26
Domestic Patent References:
| WO2019150967A1 | 2019-08-08 |
Foreign References:
| JP2017020992A | 2017-01-26 | |||
| JPH0886724A | 1996-04-02 | |||
| JP2004028787A | 2004-01-29 | |||
| JP2005249546A | 2005-09-15 | |||
| JP2006214877A | 2006-08-17 | |||
| KR20060042273A | 2006-05-12 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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