Title:
METHOD AND APPARATUS OF IMMOBILIZING SOLDER SPHERES
Document Type and Number:
WIPO Patent Application WO2001058765
Kind Code:
A3
Abstract:
A containing device (11) and method to hold and immobilize solde r spheres during storage and transport including a container portion (12) having an open top terminal end (15) and an opposing closed bottom terminal end (16) with at least one side wall (20) connecting each terminal end, a removably attachable lid (13) to seal the container portion (12) and a lid insert (14) for insertion into the container portion (12) to immobilize solder spheres contained therein. In one embodiment, the lid insert (14) is comprised of compressible material, such as a polymeric foam, whereby insertion of the lid insert (14) into the container portion (12) causes compression of the lid insert (14) substantially adjacent to the side wall (20) of the container portion (12), a bottom planar surface of the lid and an uppermost surface layer of solder spheres to completely fill any open or dead space within the containing device (11). The lid insert (14) forms a mechanical seal which immobilizes the solder spheres until the lid insert (14) is removed from the containing device (11).
Inventors:
MINOGUE GERARD R
Application Number:
PCT/US2001/004163
Publication Date:
February 14, 2002
Filing Date:
February 09, 2001
Export Citation:
Assignee:
FRYS METALS INC DBA ALPHA METALS INC (US)
International Classes:
B65D51/26; H01L21/673; H05K3/34; (IPC1-7): B65D51/26
Foreign References:
| US3010570A | 1961-11-28 | |||
| US3863795A | 1975-02-04 | |||
| FR1362570A | 1964-06-05 | |||
| US4215786A | 1980-08-05 | |||
| FR2070789A7 | 1971-09-17 | |||
| US3075667A | 1963-01-29 |
Other References:
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 15 6 April 2001 (2001-04-06)
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