METHOD AND APPARATUS FOR POLISHING OUTER PERIPHERAL CHAMFERED PART OF WAFER

Title:

METHOD AND APPARATUS FOR POLISHING OUTER PERIPHERAL CHAMFERED PART OF WAFER

Document Type and Number:

WIPO Patent Application WO/2001/062436

Kind Code:

A1

Abstract:

In a polishing method for mirror finishing the peripheral chamfered part of a wafer using an abrasive cloth while supplying abrasive to the peripheral chamfered part in order to enhance the productivity of the polishing process by shortening the polishing time, a plurality of steps including at least two polishing steps are carried out sequentially. The polishing method comprises a first polishing step for polishing the part corresponding to the {110}face of the peripheral chamfered part of a wafer, and a second polishing step for polishing the peripheral chamfered part of the wafer entirely. An abrasive cloth used in the second polishing step has a hardness lower than that of an abrasive cloth used in the first polishing step, and the abrasive used in the second polishing step has a grain size smaller than that of the abrasive used in the first polishing step. Polishing speed is varied by varying the hardness of the abrasive cloth and/or the grain size of the abrasive.

Inventors:

MIZUSHIMA KAZUTOSHI (JP)
MIURA NAKAJI (JP)
SEKINE YASUHIRO (JP)
SUZUKI MAKOTO (JP)
TOMII KAZUYA (JP)

Application Number:

PCT/JP2001/001266

Publication Date:

August 30, 2001

Filing Date:

February 21, 2001

Export Citation:

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Assignee:

SHINETSU HANDOTAI KK (JP)
MIZUSHIMA KAZUTOSHI (JP)
MIURA NAKAJI (JP)
SEKINE YASUHIRO (JP)
SUZUKI MAKOTO (JP)
TOMII KAZUYA (JP)

International Classes:

B24B9/06; B24B37/00; B24B37/20; B24B37/24; B24B51/00; B24D5/14; B24D9/04; H01L21/304; (IPC1-7): B24B9/00; H01L21/304

Foreign References:

JPH11104942A	1999-04-20
JPH11216665A	1999-08-10
JPS6471656A	1989-03-16

Other References: