Title:
METHOD AND APPARATUS FOR WELDING A SEMICONDUCTOR SUBSTRATE WITH A LASER
Document Type and Number:
WIPO Patent Application WO/2014/140423
Kind Code:
A3
Abstract:
The present invention provides for a novel method and apparatus for welding a semiconductor substrate (10) with a laser, wherein the laser (20) has a wavelength which is transparent to the material of the semiconductor substrate (10). In the novel method the laser (20) a first series of pulses (b1) is first subjected to the substrate, wherein the first series of pulses (bi) features at least two successive pulses (p1, p2, p3) which occur with substantially equal time intervals (i1, i2) of a first magnitude. Then a second series of pulses (b2) is subjected to the substrate, wherein the second series of pulses (b2) feature at least two successive pulses (p4, p5, p6) which occur with substantially equal time intervals (i4, i5) of the first magnitude. The last pulse (p3) of a previous series of pulses (b1) and the first pulse (i4) of a subsequent second series of pulses (b2) occur with a time interval (i3) of a second magnitude which is unequal of at least one order of magnitude in respect to first magnitude thus establishing a burst sequence of laser pulses.
Inventors:
KIVISTÖ SAMULI (FI)
KANGASTUPA JARNO (FI)
KANGASTUPA JARNO (FI)
Application Number:
PCT/FI2014/050175
Publication Date:
February 12, 2015
Filing Date:
March 10, 2014
Export Citation:
Assignee:
CORELASE OY (FI)
International Classes:
B23K26/00; B23K26/06; B23K26/32
Domestic Patent References:
| WO2010111089A2 | 2010-09-30 |
Foreign References:
| US20110019705A1 | 2011-01-27 |
Attorney, Agent or Firm:
SEPPO LAINE OY (Helsinki, FI)
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