Title:
METHOD AND APPARATUS FOR WIRELESS COMMUNICATION IN WIRELESS COMMUNICATION SYSTEM
Document Type and Number:
WIPO Patent Application WO/2019/139376
Kind Code:
A1
Abstract:
An operation method of a transmitting apparatus includes receiving a service data adaptation protocol (SDAP) header configuration and a header compression configuration through higher layer signaling and when an SDAP entity receives first data from an upper layer, generating an SDAP header and transmitting second data obtained by adding the generated SDAP header to the first data to a packet data convergence protocol (PDCP) entity, the generating and the transmitting being performed by the SDAP entity, performing, by the PDCP entity, header compression on an upper layer header of the second data, excluding the SDAP header, performing, by the PDCP entity, ciphering on data of the second data, excluding the SDAP header and generating a PDCP header and transmitting third data obtained by adding the generated PDCP header to the ciphered data to a lower layer, the generating and the transmitting being performed by the PDCP entity.
Inventors:
KIM SANGBUM (KR)
KIM DONGGUN (KR)
JANG JAEHYUK (KR)
KIM SOENGHUN (KR)
KIM DONGGUN (KR)
JANG JAEHYUK (KR)
KIM SOENGHUN (KR)
Application Number:
PCT/KR2019/000395
Publication Date:
July 18, 2019
Filing Date:
January 10, 2019
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H04W48/08; H04W76/27
Foreign References:
| US20170318496A1 | 2017-11-02 |
Other References:
3GPP: "3GPP; TSGRAN; E-UTRA and NR; Service Data Adaptation Protocol (SDAP) specification (Release 15", 3GPP TS 37.324 V1.1.1, 22 November 2017 (2017-11-22), pages 1 - 11, XP055528910
ASUSTEK: "Discussion on changing presence of SDAP header", R2-1712207, 3GPP TSG-RAN WG2 MEETING #100, 16 November 2017 (2017-11-16), Reno, USA, XP051370914
LG ELECTRONICS INC: "Configurability for the presence of SDAP header", R2-1713659, 3GPP TSG-RAN2 MEETING #100, 17 November 2017 (2017-11-17), Reno, USA, XP051372325
3GPP: "3GPP; TSGRAN; NR; NR and NG-RAN Overall Description; Stage 2 (Release 15)", 3GPP TS 38.300 V.15.0.0, 4 January 2018 (2018-01-04), pages 1 - 68, XP055624954
ASUSTEK: "Discussion on changing presence of SDAP header", R2-1712207, 3GPP TSG-RAN WG2 MEETING #100, 16 November 2017 (2017-11-16), Reno, USA, XP051370914
LG ELECTRONICS INC: "Configurability for the presence of SDAP header", R2-1713659, 3GPP TSG-RAN2 MEETING #100, 17 November 2017 (2017-11-17), Reno, USA, XP051372325
3GPP: "3GPP; TSGRAN; NR; NR and NG-RAN Overall Description; Stage 2 (Release 15)", 3GPP TS 38.300 V.15.0.0, 4 January 2018 (2018-01-04), pages 1 - 68, XP055624954
Attorney, Agent or Firm:
Y.P.LEE, MOCK & PARTNERS (KR)
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