METHOD FOR ARRAYING CHIPS OF THERMOELECTRIC CONVERSION MATERIAL

Title:

METHOD FOR ARRAYING CHIPS OF THERMOELECTRIC CONVERSION MATERIAL

Document Type and Number:

WIPO Patent Application WO/2022/092179

Kind Code:

A1

Abstract:

Provided is a method for efficiently arraying a chip of a P-type thermoelectric conversion material and a chip of an N-type thermoelectric conversion material collectively on a support. A method for arraying chips of a thermoelectric conversion material is provided, in which the chips of the thermoelectric conversion material include a chip of a P-type thermoelectric conversion material and a chip of an N-type thermoelectric conversion material, the method comprising steps (A) to (J) (see the Description).

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Inventors:

SEKI YUTA (JP)
KATO KUNIHISA (JP)
MORITA WATARU (JP)
HORIGOME KATSUHIKO (JP)
MASUMOTO MUTSUMI (JP)

Application Number:

PCT/JP2021/039752

Publication Date:

May 05, 2022

Filing Date:

October 28, 2021

Export Citation:

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Assignee:

LINTEC CORP (JP)

International Classes:

H01L35/34; H01L35/24; H01L35/26; H02N11/00

Domestic Patent References:

WO2003105244A1	2003-12-18
WO2018139475A1	2018-08-02

Foreign References:

JP2004221109A	2004-08-05
JP2005019767A	2005-01-20

Attorney, Agent or Firm:

OHTANI PATENT OFFICE (JP)

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