METHOD FOR SEPARATING/RECOVERING BASE

Title:

METHOD FOR SEPARATING/RECOVERING BASE

Document Type and Number:

WIPO Patent Application WO/2024/024724

Kind Code:

A1

Abstract:

Provided is a method for separating/recovering a base, the method being suitable for plastic recycling and, even when used for a laminate of a base with a pressure-sensitive adhesive sheet comprising a support and a pressure-sensitive adhesive layer formed in an amount of 10-100 g/m2, having an excellent ability to remove the pressure-sensitive adhesive sheet and inhibiting the removed components from re-adhering. The method for separating/recovering a base includes a step in which the laminate is immersed in a remover liquid to remove the pressure-sensitive adhesive sheet, and is characterized in that the remover liquid contains a basic compound, a surfactant having an HLB of 7 or greater, and a defoaming agent.

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Inventors:

WATANABE TATSUYA (JP)
FURUNO HIROYUKI (JP)

Application Number:

PCT/JP2023/027002

Publication Date:

February 01, 2024

Filing Date:

July 24, 2023

Export Citation:

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Assignee:

ARTIENCE CO LTD (JP)
TOYOCHEM CO LTD (JP)

International Classes:

B29B17/02; C08J11/08; C09J7/38; C09J133/00; C11D3/04; C11D17/08

Foreign References:

JP2012201748A	2012-10-22
JP2010012636A	2010-01-21
JP2011072867A	2011-04-14
JPS58207393A	1983-12-02
JP2022095599A	2022-06-28

Attorney, Agent or Firm:

IEIRI Takeshi (JP)

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