Title:
METHOD FOR BONDING RESIN TUBES
Document Type and Number:
WIPO Patent Application WO/2016/147874
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a method for bonding resin tubes, which has a high degree of freedom in selection of materials for tubes, while being free from the occurrence of defects such as hardening and shrinkage in the bonded portions of tubes.
A method for bonding resin tubes according to the present invention is a method for bonding a first tube formed from a synthetic resin and a second tube formed from a synthetic resin. This method for bonding resin tubes is characterized by comprising: a surface activation step for activating a bonding region of the first tube and a bonding region of the second tube; and a close contact step for brining the bonding region of the first tube and the bonding region of the second tube into close contact with each other after the surface activation step.
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Inventors:
TAKEMOTO FUMITOSHI (JP)
WASAMOTO MAKOTO (JP)
SUZUKI SHINJI (JP)
WASAMOTO MAKOTO (JP)
SUZUKI SHINJI (JP)
Application Number:
PCT/JP2016/056527
Publication Date:
September 22, 2016
Filing Date:
March 03, 2016
Export Citation:
Assignee:
USHIO ELECTRIC INC (JP)
International Classes:
B29C65/14
Foreign References:
| JP2002524597A | 2002-08-06 | |||
| JP2007312942A | 2007-12-06 |
Attorney, Agent or Firm:
OHI, Masahiko (JP)
Masahiko Oi (JP)
Masahiko Oi (JP)
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