Title:
METHOD FOR BONDING SEPARATOR, METHOD FOR PRODUCING ELECTROCHEMICAL DEVICE, AND ELECTROCHEMICAL DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/179653
Kind Code:
A1
Abstract:
According to the present invention, a method for bonding a separator 3 which has a multilayer structure comprising a substrate layer 3a and a ceramic layer 3b that is laminated on at least one surface of the substrate layer 3a and has higher heat resistance than the substrate layer 3a comprises: a step wherein an adhesive member 10 is bonded to the ceramic layer 3b and subsequently removed therefrom, so that a part of the ceramic layer 3b is removed together with the adhesive member 10; and a step wherein the separator 3 is thermally welded to another separator by heating a portion of the separator 3, from which the ceramic layer 3b has been removed.
Inventors:
KISHI MAYUKO (JP)
IWATA NAOYUKI (JP)
IWATA NAOYUKI (JP)
Application Number:
PCT/JP2017/047019
Publication Date:
October 04, 2018
Filing Date:
December 27, 2017
Export Citation:
Assignee:
NEC ENERGY DEVICES LTD (JP)
International Classes:
H01G11/52; H01M50/451; H01M50/466
Domestic Patent References:
| WO2016056428A1 | 2016-04-14 |
Foreign References:
| JP2013257987A | 2013-12-26 | |||
| JP2016081711A | 2016-05-16 | |||
| JP2013218925A | 2013-10-24 | |||
| JP2012128979A | 2012-07-05 | |||
| JP2013165024A | 2013-08-22 | |||
| JP2017157346A | 2017-09-07 |
Attorney, Agent or Firm:
MIYAZAKI Teruo et al. (JP)
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