Title:
METHOD FOR BONDING SUBSTRATE AND DISPLAY SUBSTRATE MANUFACTURED THROUGH SAME METHOD
Document Type and Number:
WIPO Patent Application WO/2018/105901
Kind Code:
A1
Abstract:
Disclosed are a substrate bonding method in which inter-substrate bonding can be achieved by light irradiation and photocuring even when an opaque substrate is used, and a display substrate manufactured through the same method. The substrate bonding method comprises the steps of: (a) printing a photo-curable adhesive ink on a lower substrate to make a pattern thereon; (b) photocuring the pattern to form a spacer on the lower substrate; (c) printing a photo-curable adhesive ink on the lower substrate including the spacer to form an adhesive layer; (d) irradiating light on the adhesive layer formed on the lower substrate; and (e) attaching an upper substrate to the adhesive layer of the lower substrate to integrate the upper substrate and the lower substrate, wherein the upper substrate and the lower substrate are transparent or opaque and are homogeneous or heterogeneous.
Inventors:
BACK SEUNG A (KR)
KIM JOON HYUNG (KR)
KIM JOON HYUNG (KR)
Application Number:
PCT/KR2017/012568
Publication Date:
June 14, 2018
Filing Date:
November 08, 2017
Export Citation:
Assignee:
LG CHEMICAL LTD (KR)
International Classes:
C09J5/00; C09D11/101
Foreign References:
| KR20160064030A | 2016-06-07 | |||
| KR20160110334A | 2016-09-21 | |||
| US20080124525A1 | 2008-05-29 | |||
| US20100253894A1 | 2010-10-07 | |||
| JP2006036865A | 2006-02-09 |
Attorney, Agent or Firm:
KIM, Aera (KR)
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