Title:
METHOD FOR BONDING SUBSTRATES CONTAINING POLYMERS ON SURFACES THEREOF, BONDING APPARATUS, AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2023/234414
Kind Code:
A1
Abstract:
Provided are: a method for bonding substrates containing polymers on the surfaces thereof; a bonding apparatus; and a laminate, applicable to high-frequency circuits in which substrates containing polymers on the surfaces thereof are firmly bonded with each other at low temperatures. The method for bonding substrates containing polymers on the surfaces thereof comprises: forming a precursor layer by radiating a first ultraviolet ray in a state in which a certain concentration of a crosslinking substance is present on one or both of the bonding surface of a first substrate 61 and the bonding surface of a second substrate 62; and bringing the first substrate and the second substrate into contact with each other to bond the first substrate 61 and the second substrate 62 via the precursor layer.
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Inventors:
MATSUMOTO YOSHIIE (JP)
SHIGETOU AKITSU (JP)
SHIGETOU AKITSU (JP)
Application Number:
PCT/JP2023/020698
Publication Date:
December 07, 2023
Filing Date:
June 02, 2023
Export Citation:
Assignee:
SEN ENG CO LTD (JP)
NAT INST MATERIALS SCIENCE (JP)
NAT INST MATERIALS SCIENCE (JP)
International Classes:
B29B13/08; B29C65/00; B32B7/10; C08J5/12; C09J5/00; H05K1/03
Domestic Patent References:
| WO2019221288A1 | 2019-11-21 | |||
| WO2008007787A1 | 2008-01-17 |
Foreign References:
| JP2015051542A | 2015-03-19 | |||
| JP2003321656A | 2003-11-14 |
Attorney, Agent or Firm:
SONODA & KOBAYASHI INTELLECTUAL PROPERTY LAW (JP)
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