METHOD FOR CLOSING HOLE

Title:

METHOD FOR CLOSING HOLE

Document Type and Number:

WIPO Patent Application WO/2011/016516

Kind Code:

A1

Abstract:

Provide is a method for closing a hole in an object with a film. The method comprises: attaching the object to an electric discharge machine as a workpiece; making an electrode approach the object so as to be overlapped with the hole, the electrode being formed of a powder including a conductive material; repeatedly applying a voltage by using the electric discharge machine between the electrode and the object so that discharging occurs therebetween and thereby growing a film for closing the hole from the periphery of the hole; and performing a mechanical process for sloping the edge of the hole before a step for applying the voltage or sloping the film along the edge of the hole during the step for applying the voltage.

Inventors:

FURUKAWA TAKASHI (JP)
SHIMODA YUKIHIRO (JP)
WATANABE MITSUTOSHI (JP)
OCHIAI HIROYUKI (JP)

Application Number:

PCT/JP2010/063280

Publication Date:

February 10, 2011

Filing Date:

August 05, 2010

Export Citation:

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Assignee:

IHI CORP (JP)
FURUKAWA TAKASHI (JP)
SHIMODA YUKIHIRO (JP)
WATANABE MITSUTOSHI (JP)
OCHIAI HIROYUKI (JP)

International Classes:

C23C26/00

Domestic Patent References:

WO2004111303A1

2004-12-23

Foreign References:

JP2005213556A	2005-08-11
JP2007211351A	2007-08-23
JP2005211156A	2005-08-11

Other References: