Title:
METHOD OF COMPOSITE INJECTION MOLDING AND MOLD
Document Type and Number:
WIPO Patent Application WO/2004/022306
Kind Code:
A1
Abstract:
A molded article obtained by composite injection molding and improved in adhesion and airtightness between the primary-side resin molding and the secondary-side resin molding. The method, which is for forming a molded article by composite injection molding, comprises injection-molding a secondary-side resin molding (2) on a primary-side resin molding (1), wherein the molding material is compressed from the side of the secondary-side resin molding (2) to thereby improve adhesion and airtightness between the primary-side resin molding (1) and the secondary-side resin molding (2). In this method, an area which may come to have poor adhesion between the primary-side resin molding (1) and the secondary-side resin molding (2) can be selectively and locally compressed.
Inventors:
SEITO HIROMITSU (JP)
MIWA KATSUMASA (JP)
MIWA KATSUMASA (JP)
Application Number:
PCT/JP2003/011216
Publication Date:
March 18, 2004
Filing Date:
September 02, 2003
Export Citation:
Assignee:
POLYPLASTICS CO (JP)
SEITO HIROMITSU (JP)
MIWA KATSUMASA (JP)
SEITO HIROMITSU (JP)
MIWA KATSUMASA (JP)
International Classes:
B29C45/16; B29C45/56; (IPC1-7): B29C45/16; B29C45/56
Foreign References:
JP2001047463A | 2001-02-20 | |||
JPH11170305A | 1999-06-29 | |||
JPS61150110U | 1986-09-17 | |||
JPS529540A | 1977-01-25 | |||
JPH05200801A | 1993-08-10 |
Other References:
See also references of EP 1541317A4
Attorney, Agent or Firm:
Miura, Yoshikazu (4 Kojimachi 5-chom, Chiyoda-ku Tokyo, JP)
Download PDF: