Title:
METHOD OF CREATING AN ELECTRICAL INTERCONNECT DEVICE BEARING AN ARRAY OF ELECTRICAL CONTACT PADS
Document Type and Number:
WIPO Patent Application WO2000068972
Kind Code:
A3
Abstract:
A method of constructing a planar array (10) of electrical contact pads (12) is disclosed, comprising the following steps. First, providing a set of dielectric layers (110, 112, 114, 116) each having two major surfaces and forming a set of first conductive paths (120) on a first major surfaces (110a, 112a, 114a, 116a). Second, forming a set of second conductive paths (122) on a second major surface (110b, 112b, 114b, 116b). Third, joining the set of dielectric layers (110a, 112a, 114a, 116a). Forth, forming an array (10) of first and second electrical contact pads (12) on the top surface. Fifth and finally, forming a set of plated vias (138) to connect each first electrical contact pad (12) to a first conductive path (12) and each second electrical contact pad (12) to a second conductive path (122).
Inventors:
ROSS BENJAMIN B (US)
JORDAN PHILLIP L (US)
STROLE JEFFERY A (US)
JORDAN PHILLIP L (US)
STROLE JEFFERY A (US)
Application Number:
PCT/US2000/013140
Publication Date:
June 28, 2001
Filing Date:
May 12, 2000
Export Citation:
Assignee:
MICROSOUND SYSTEMS INC (US)
ROSS BENJAMIN B (US)
JORDAN PHILLIP L (US)
STROLE JEFFERY A (US)
ROSS BENJAMIN B (US)
JORDAN PHILLIP L (US)
STROLE JEFFERY A (US)
International Classes:
G01R1/073; H01L23/498; H05K1/11; H05K3/00; H05K3/40; H05K3/46; G01R31/26; H05K1/02; (IPC1-7): B05D5/06; B32B31/20; H05B33/02; H05B33/10; H01K3/10; H05K3/36; H05K3/46
Foreign References:
| US6007669A | 1999-12-28 | |||
| US5756147A | 1998-05-26 | |||
| US6083340A | 2000-07-04 | |||
| US6021564A | 2000-02-08 | |||
| US5886535A | 1999-03-23 | |||
| US5679472A | 1997-10-21 |
Other References:
See also references of EP 1125330A4
Download PDF: