Title:
METHOD FOR CUTTING BRITTLE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2017/056876
Kind Code:
A1
Abstract:
A cutting edge (51) having a protruding portion (PP) and a side portion (PS) that extends from the protruding portion (PP) and has a convex shape is caused to slide on one surface (SF1) of a brittle substrate (4) in a direction from the protruding portion (PP) toward the side portion (PS), whereby a trench line (TL) having a groove shape is formed by the generation of plastic deformation on the one surface (SF1). A crack line (CL) is formed by extending a crack of the brittle substrate (4) along at least a part of the trench line (TL). The brittle substrate (4) is cut along the crack line (CL). The step for forming the trench line (TL) is carried out such that the direction in which the crack line (CL) extends along the trench line (TL) in the step for forming the crack line (CL) is the same as the direction in which the trench line (TL) is formed.
Inventors:
SOYAMA HIROSHI (JP)
Application Number:
PCT/JP2016/076184
Publication Date:
April 06, 2017
Filing Date:
September 06, 2016
Export Citation:
Assignee:
MITSUBOSHI DIAMOND IND CO LTD (JP)
International Classes:
B28D5/00; C03B33/037
Foreign References:
| JP2015074145A | 2015-04-20 | |||
| JPH07240571A | 1995-09-12 | |||
| JP2005079526A | 2005-03-24 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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