Title:
METHOD FOR CUTTING AND CHAMFERING TEMPERED GLASS
Document Type and Number:
WIPO Patent Application WO/2015/093726
Kind Code:
A1
Abstract:
The present invention relates to a method for cutting and chamfering tempered glass, and more specifically, to a method for quickly cutting tempered glass without causing defects and for chamfering so as to produce a uniform surface and high tensile strength, by comprising the steps of: cutting the tempered glass at a speed of no more than 800mm/min while spraying 120 to 380 mesh cutting particles, at an injection pressure of 0.1 to 2 Mpa; and chamfering the cut surface by bringing into contact a heat source at a temperature of 700 to 1,700°C to the cut surface of the tempered glass, and then moving same at a speed of 5 to 300mm/sec.
Inventors:
LEE HAN BAE (KR)
SON DONG JIN (KR)
LEE DONG HUN (KR)
PARK DAE CHUL (KR)
SON DONG JIN (KR)
LEE DONG HUN (KR)
PARK DAE CHUL (KR)
Application Number:
PCT/KR2014/010368
Publication Date:
June 25, 2015
Filing Date:
October 31, 2014
Export Citation:
Assignee:
DONGWOO FINE CHEM CO LTD (KR)
International Classes:
B24C3/00; B24C5/02
Foreign References:
| KR20130092713A | 2013-08-21 | |||
| JP2001294437A | 2001-10-23 | |||
| KR20060096973A | 2006-09-13 | |||
| KR20120018765A | 2012-03-05 |
Attorney, Agent or Firm:
DOOHO IP LAW FIRM (KR)
두호특허법인 (KR)
두호특허법인 (KR)
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