Title:
METHOD FOR CUTTING SEALING SHEET AND DEVICE FOR CUTTING SEALING SHEET
Document Type and Number:
WIPO Patent Application WO/2014/174963
Kind Code:
A1
Abstract:
The present invention cuts a sealing sheet (T), which is pasted covering a notch formed at a substrate, by aligning a cutter (41) provided to a first cutting mechanism (8) along the external diameter of a substrate while causing the notch section (V) of the sealing sheet to remain. Afterwards, a blade edge imparts a cut along the notch from one side of the open end of the notch to the back end by means of the cutter (64) of a second cutting mechanism (11), and then is retracted, and then the substrate is rotated and the blade edge of the cutter imparts a cut along the notch from the other side of the open end of the notch to the back end, connecting to the previous half of the cut, and thus the sealing sheet is cut out in the notch shape.
Inventors:
ISHII NAOKI (JP)
MORI SHINICHIROU (JP)
YAMAMOTO MASAYUKI (JP)
MORI SHINICHIROU (JP)
YAMAMOTO MASAYUKI (JP)
Application Number:
PCT/JP2014/058121
Publication Date:
October 30, 2014
Filing Date:
March 24, 2014
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B26D3/14; B26D3/10; H01L21/683
Foreign References:
| JP2011198980A | 2011-10-06 | |||
| JP2009130270A | 2009-06-11 | |||
| JP2004025402A | 2004-01-29 |
Attorney, Agent or Firm:
SUGITANI Tsutomu (JP)
Tsutomu Sugitani (JP)
Tsutomu Sugitani (JP)
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