Title:
METHOD FOR CUTTING SILICON INGOT USING WIRE SAW, AND WIRE SAW
Document Type and Number:
WIPO Patent Application WO/2011/043177
Kind Code:
A1
Abstract:
Disclosed is a method for cutting a silicon ingot, wherein the quantity of a fixed-abrasive grain wire required for the purpose of slicing the silicon ingot is reduced as much as possible and manufacture cost is significantly reduced, in the case of slicing the silicon ingot using the fixed-abrasive grain wire saw. The wire saw is also disclosed. In the method of cutting the silicon ingot using the wire saw, the fixed-abrasive grain wire travels, while having a coolant supplied on the wire, said fixed-abrasive grain wire being spirally wound at a fixed pitch on the circumferential surfaces of a plurality of rollers, and at the same time, the silicon ingot moves relatively with respect to the wire, in a state wherein the coolant is also supplied to the silicon ingot surface section on the processing side, said surface section being a section where the wire passes through at the time of cutting the silicon ingot, and the silicon ingot is sliced and a plurality of silicon wafers are manufactured.
Inventors:
NAKASHIMA AKIRA (JP)
KAIGA YUKINOBU (JP)
KAIGA YUKINOBU (JP)
Application Number:
PCT/JP2010/066119
Publication Date:
April 14, 2011
Filing Date:
September 13, 2010
Export Citation:
Assignee:
SUMCO CORP (JP)
NAKASHIMA AKIRA (JP)
KAIGA YUKINOBU (JP)
NAKASHIMA AKIRA (JP)
KAIGA YUKINOBU (JP)
International Classes:
H01L21/304; B24B27/06; B24B55/02; B28D5/04
Foreign References:
| JP2004042241A | 2004-02-12 | |||
| JP2000000750A | 2000-01-07 | |||
| JPH09193140A | 1997-07-29 |
Attorney, Agent or Firm:
SUGIMURA, KENJI (JP)
Kenji Sugimura (JP)
Kenji Sugimura (JP)
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