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Title:
METHOD FOR CUTTING SILICON INGOT
Document Type and Number:
WIPO Patent Application WO/2023/119954
Kind Code:
A1
Abstract:
This method for cutting a silicon ingot is characterized in that a silicon ingot is cut by running a fixed-abrasive wire at a speed which has a maximum speed of at least 1,200 m/minute while supplying a coolant thereto which has a water content greater than 99%.

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Inventors:
HASHIMOTO DAISUKE (JP)
Application Number:
PCT/JP2022/042414
Publication Date:
June 29, 2023
Filing Date:
November 15, 2022
Export Citation:
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Assignee:
SUMCO CORP (JP)
International Classes:
H01L21/304; B24B27/06; B24B55/02; B28D5/04
Domestic Patent References:
WO2019142494A12019-07-25
Foreign References:
JP2017220546A2017-12-14
JP2012236259A2012-12-06
JP2013094872A2013-05-20
JPH11198020A1999-07-27
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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