Title:
METHOD AND DEVICE FOR CUTTING PLATE GLASS
Document Type and Number:
WIPO Patent Application WO/2005/054142
Kind Code:
A1
Abstract:
A method for cutting a plate glass capable of providing a satisfactory cutting face with excellent linearity also for a rather thick plate glass by preventing cullet from producing in cutting the plate glass utilizing thermal strain, wherein the plate glass is heated along a virtual cutting line by a heating burner after an incisure as a crack start point is engraved in the plate glass at a cutting start point, and the virtual cutting line part of the plate glass at the heated portion is locally cooled by mist generated by a cooling nozzle having a liquid jetting port at the center projected from a gas jetting port on the outer periphery to develop fine cracks at the incisure along the virtual cutting line so as to form cracks necessary for cutting the plate glass.
Inventors:
KATAOKA YASUYOSHI (JP)
TAKAHASHI TOMIO (JP)
TAKAHASHI TOMIO (JP)
Application Number:
PCT/JP2004/017967
Publication Date:
June 16, 2005
Filing Date:
December 02, 2004
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
KATAOKA YASUYOSHI (JP)
TAKAHASHI TOMIO (JP)
KATAOKA YASUYOSHI (JP)
TAKAHASHI TOMIO (JP)
International Classes:
B27M1/00; B27M1/02; B27M1/06; C03B33/023; C03B33/09; (IPC1-7): C03B33/09; B26F3/06
Foreign References:
| JP2003512943A | 2003-04-08 | |||
| JP2000063137A | 2000-02-29 | |||
| JP2003534132A | 2003-11-18 | |||
| JP2003238180A | 2003-08-27 |
Other References:
See also references of EP 1690835A4
None
None
Attorney, Agent or Firm:
Senmyo, Kenji (38 Kanda-Higashimatsushitacho, Chiyoda-k, Tokyo 42, JP)
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