Title:
METHOD AND DEVICE FOR DIVIDING PLATE-LIKE MEMBER
Document Type and Number:
WIPO Patent Application WO/2004/100240
Kind Code:
A1
Abstract:
A method and a device for dividing a plate-like member capable of providing a plurality of substrates by forming a linear reforming area on or in the plate-like member formed of a rigid and brittle material and dividing the plate-like member along the reforming area. The method comprises a tape sticking step for sticking tape on the surface of the plate-like member, a reforming area formation step for forming the reforming area on or in the plate-like member on which the tape was stuck, and an expand step for elongating the tape by applying a tension thereto after the reforming area formation step is completed. In the expand step, UV ray is radiated to the tape. Thus, an extremely thin chip having excellent end face shape can be securely manufactured without producing undivided portion, chipping, and cracking.
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Inventors:
SAKAYA YASUYUKI (JP)
AZUMA MASAYUKI (JP)
AZUMA MASAYUKI (JP)
Application Number:
PCT/JP2004/006321
Publication Date:
November 18, 2004
Filing Date:
April 30, 2004
Export Citation:
Assignee:
TOKYO SEIMITSU CO LTD (JP)
SAKAYA YASUYUKI (JP)
AZUMA MASAYUKI (JP)
SAKAYA YASUYUKI (JP)
AZUMA MASAYUKI (JP)
International Classes:
B23K26/00; B23K26/40; B28D5/00; H01L21/00; H01L21/301; (IPC1-7): H01L21/301; B28D5/00; B23K26/00
Foreign References:
| JP2002110588A | 2002-04-12 | |||
| JPH06188310A | 1994-07-08 | |||
| JP2002192370A | 2002-07-10 |
Attorney, Agent or Firm:
Matsuura, Kenzo (Shinjuku Sumitomo Bldg. 20F 6-1,
Nishi-shinjuku 2-chom, Shinjuku-ku Tokyo, JP)
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