Title:
METHOD AND DEVICE FOR FILLING HOLES IN POINT CLOUD, AND STORAGE MEDIUM
Document Type and Number:
WIPO Patent Application WO/2021/114030
Kind Code:
A1
Abstract:
A method and device for filling holes in a point cloud, and a storage medium. The method comprises: projecting, onto a two-dimensional plane, point cloud data to undergo hole filling, and forming a two-dimensional image on the basis of the two-dimensional plane obtained after the projection (S410); generating a hole template corresponding to the two-dimensional image, the hole template indicating locations of holes in a point cloud in the two-dimensional image (S420); and using the hole template to perform filling with respect to the two-dimensional image (S430). Performing hole filling after a three-dimensional point cloud has been projected to a two-dimensional plane greatly reduces the sparseness of point distribution, thereby reducing processing difficulties. Moreover, characteristics of different point cloud scanning methods generated by different point cloud scanning approaches are taken into consideration in order to generate hole templates, and then the hole templates are used to perform hole filling, thereby adapting to various point cloud detection systems.
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Inventors:
XIA QING (CN)
LI YANZHAO (CN)
LI YANZHAO (CN)
Application Number:
PCT/CN2019/124049
Publication Date:
June 17, 2021
Filing Date:
December 09, 2019
Export Citation:
Assignee:
SZ DJI TECHNOLOGY CO LTD (CN)
International Classes:
G06T7/00
Foreign References:
| CN110286387A | 2019-09-27 | |||
| CN110286387A | 2019-09-27 | |||
| CN108399609A | 2018-08-14 | |||
| CN108198145A | 2018-06-22 | |||
| US20170140539A1 | 2017-05-18 | |||
| US20180276793A1 | 2018-09-27 |
Attorney, Agent or Firm:
P. C. & ASSOCIATES (CN)
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