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Patent Searching and Data


Title:
METHOD AND DEVICE FOR MANUFACTURING BONDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2021/246036
Kind Code:
A1
Abstract:
The method for manufacturing a bonded article according to the present invention includes: a step for providing a first metal member having an opening and a bonding structure; a step for providing a second metal member having a to-be-bonded structure of which an outer circumferential wall contactable with an inner circumferential wall surrounding the opening is to be bonded with the bonding structure; a step for relatively moving the first and second metal members and bringing one of a first boding part comprising the inner circumferential wall and the outer circumferential wall and a second bonding part comprising the bonding structure and the to-be-bonded structure into contact while moving away the other; a step for starting passing current between the first and second metal members; a step for bringing components of the other bonding part into contact with each other; and a step for bonding the first and second boding parts through the relative movement and the passing of current.

Inventors:
HAYASHI TOSHIHIKO (JP)
Application Number:
PCT/JP2021/013726
Publication Date:
December 09, 2021
Filing Date:
March 30, 2021
Export Citation:
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Assignee:
ORIGIN CO LTD (JP)
International Classes:
B23K11/02
Foreign References:
JP2016209926A2016-12-15
JP2011245512A2011-12-08
JP2011098358A2011-05-19
JP2004017048A2004-01-22
JP2020096230A2020-06-18
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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