Title:
METHOD AND DEVICE FOR MANUFACTURING PLATED WIRE
Document Type and Number:
WIPO Patent Application WO/2020/071002
Kind Code:
A1
Abstract:
A method for manufacturing plated wire rod, having: a step for preparing a plated wire rod precursor having a drawn wire-shaped base material and a plating coating provided on the surface of the base material, the base material in the step comprising a first metal, and the plating coating comprising a second metal having a different composition than the first metal; a step for performing skin-pass processing of the plated wire rod precursor using a die, and obtaining a plated wire rod intermediate; a step for inspecting the plated wire rod intermediate for the presence of defects using an eddy current flaw detector and a camera inspection device after the skin-pass processing; and a step for removing defects in the plated wire rod intermediate detected in the inspection step and obtaining a plated wire rod.
Inventors:
TSUCHIDA HITOSHI (JP)
KAMOGAWA DAI (JP)
OMURA TADASHI (JP)
NAKAGAWA TOSHITAKA (JP)
KAMOGAWA DAI (JP)
OMURA TADASHI (JP)
NAKAGAWA TOSHITAKA (JP)
Application Number:
PCT/JP2019/032871
Publication Date:
April 09, 2020
Filing Date:
August 22, 2019
Export Citation:
Assignee:
SUMITOMO ELECTRIC TOYAMA CO (JP)
International Classes:
B21C51/00; B21B1/00; B21C37/04; G01N21/892; G01N27/90; H01B5/02; H01B13/00
Foreign References:
| JP2015029995A | 2015-02-16 | |||
| JPH0623432A | 1994-02-01 | |||
| JP2003053420A | 2003-02-26 | |||
| JPH08141640A | 1996-06-04 | |||
| JP2000156450A | 2000-06-06 | |||
| JPS62287634A | 1987-12-14 | |||
| JPH105848A | 1998-01-13 | |||
| JP2018186596A | 2018-11-22 | |||
| JP2004303680A | 2004-10-28 | |||
| JP2003147579A | 2003-05-21 | |||
| JP2015120966A | 2015-07-02 |
Other References:
See also references of EP 3678143A4
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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