Title:
METHOD AND DEVICE FOR MEASURING CRACK DEPTH OF STRUCTURE BY USING THERMAL IMAGING
Document Type and Number:
WIPO Patent Application WO/2020/055195
Kind Code:
A1
Abstract:
On the basis of the depth of a crack generated in a structure, and the temperature and the environmental information extracted from a thermal image as training data, according to the present invention, machine learning is performed, and on the basis of the temperature of the crack portion extracted from the thermal image of the crack photographed of the actual structure, it is possible to accurately measure the depth of the crack. Therefore, in addition to simply determining whether or not a crack has occurred in a structure, it is also possible to measure the depth of a crack in a thermal image, thereby being capable of determining the integrity of the structure more accurately.
Inventors:
JU YOUNG-KYU (KR)
JEONG DONG-MIN (KR)
LEE JONG-HOON (KR)
JEONG DONG-MIN (KR)
LEE JONG-HOON (KR)
Application Number:
PCT/KR2019/011883
Publication Date:
March 19, 2020
Filing Date:
September 11, 2019
Export Citation:
Assignee:
UNIV KOREA RES & BUS FOUND (KR)
International Classes:
G01B11/22; G06T7/00; G06T7/50; H04N5/33
Foreign References:
| KR20160142482A | 2016-12-13 | |||
| US20160202199A1 | 2016-07-14 | |||
| JP2008151809A | 2008-07-03 | |||
| JP6294529B1 | 2018-03-14 | |||
| KR20170136133A | 2017-12-11 |
Attorney, Agent or Firm:
KANG, Kyi-young et al. (KR)
Download PDF: