Title:
METHOD AND DEVICE FOR MOLDING TIRE
Document Type and Number:
WIPO Patent Application WO/2018/216390
Kind Code:
A1
Abstract:
Provided are a method and a device for molding a tire with which an outer peripheral side band-shaped rubber member wound relatively on an outer peripheral side of a molding drum is laminated protruding in a drum width direction with respect to an inner peripheral side band-shaped rubber member wound relatively on an inner peripheral side to make it possible to firmly bond ends in a longitudinal direction together while reducing a deviation of a bonding position when the ends in the longitudinal direction are bonded together to be molded into a cylindrical shape. When ends 8A in a longitudinal direction of an outer peripheral side band-shaped rubber member 8 wound on a molding drum 2 are bonded together to be molded into a cylindrical shape, an inner peripheral surface 8a of a protruding part 8c of each of the ends 8A in the longitudinal direction that protrudes in a drum width direction with respect to an inner peripheral side band-shaped rubber member 7 is supported by a supporting part 4 and the protruding part 8c is pressed in the drum width direction by a pressing part 5 to bond the ends 8A in the longitudinal direction to each other with the inner peripheral surface 8a positioned at the same level as an outer peripheral surface 7b of the inner peripheral side band-shaped rubber member 7.
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Inventors:
YAMAMURA EIJI (US)
KUMAZAWA TOMOHIRO (US)
KUMAZAWA TOMOHIRO (US)
Application Number:
PCT/JP2018/015486
Publication Date:
November 29, 2018
Filing Date:
April 13, 2018
Export Citation:
Assignee:
YOKOHAMA RUBBER CO LTD (JP)
International Classes:
B29D30/30
Foreign References:
| JP2015231689A | 2015-12-24 | |||
| JP2009137041A | 2009-06-25 | |||
| JPS58151235A | 1983-09-08 | |||
| JP2007168189A | 2007-07-05 | |||
| JPS5849235A | 1983-03-23 | |||
| JP2011240691A | 2011-12-01 |
Other References:
See also references of EP 3632668A4
Attorney, Agent or Firm:
SEIRYU PATENT PROFESSIONAL CORPORATION et al. (JP)
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