METHOD AND DEVICE FOR POLISHING SEMICONDUCTOR WAFER

Title:

METHOD AND DEVICE FOR POLISHING SEMICONDUCTOR WAFER

Document Type and Number:

WIPO Patent Application WO/2001/015860

Kind Code:

A1

Abstract:

A polishing cloth is used to polish a semiconductor wafer, particularly to give a mirror finish, without causing damage to the wafer surface. The polishing cloth has a zinc compound content of less than 200 ppm in terms of the weight of zinc in the polishing cloth, preferably less than 100 ppm, and more preferably no zinc compound is contained. The polishing cloth (1) includes a base layer (22), preferably of unwoven cloth, and a porous surface layer (21), preferably of polyurethane foam. The zinc compound content in the surface layer (21) is less than 100 ppm in terms of the weight of zinc in the surface layer (21).

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Inventors:

KOBAYASHI MAKOTO (JP)
TAKAMATSU HIROYUKI (JP)

Application Number:

PCT/JP2000/005595

Publication Date:

March 08, 2001

Filing Date:

August 21, 2000

Export Citation:

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Assignee:

SHINETSU HANDOTAI KK (JP)
KOBAYASHI MAKOTO (JP)
TAKAMATSU HIROYUKI (JP)

International Classes:

B24B37/20; B24B37/22; B24B37/24; B24D3/26; B24D13/14; H01L21/306; (IPC1-7): B24B37/00; H01L21/304

Foreign References:

JPH08300252A	1996-11-19
JPH05129257A	1993-05-25

Other References: