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Title:
METHOD AND DEVICE FOR SIMULTANEOUSLY GRINDING DOUBLE SURFACES, AND METHOD AND DEVICE FOR SIMULTANEOUSLY LAPPING DOUBLE SURFACES
Document Type and Number:
WIPO Patent Application WO/2000/067950
Kind Code:
A1
Abstract:
A method and a device for simultaneously grinding (lapping) double surfaces, characterized in that a relative position of the center of a thickness of a platy work and/or the center of holding means holding the platy work to the center of a distance between the surfaces of the grinding wheels (surface plates) of a pair of grinding wheels (lapping surface plates) is controlled for grinding (lapping) in a method of simultaneously grinding (lapping) both surfaces of the platy work using the pair of grinding wheels (lapping surface plates) holding the play work and provided opposedly to both front and rear surfaces of the platy work, whereby, in a double surface simultaneous grinding (lapping) using a double surface simultaneous grinding (lapping) machine, a deflection of the platy work is suppressed from occurring and the deflection due to grinding (lapping) is prevented from becoming worse so that both surfaces of the platy work can be machined in a highly flat shape, and the polishing (lapping) is performed while the magnitude of the deflection is being controlled so as to machine the platy work to have a desired deflection.

Inventors:
IKEDA SHUNICHI (JP)
OKUNI SADAYUKI (JP)
KATO TADAHIRO (JP)
Application Number:
PCT/JP2000/002788
Publication Date:
November 16, 2000
Filing Date:
April 27, 2000
Export Citation:
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Assignee:
SHINETSU HANDOTAI KK (JP)
IKEDA SHUNICHI (JP)
OKUNI SADAYUKI (JP)
KATO TADAHIRO (JP)
International Classes:
B24B7/17; B24B7/22; B24B37/08; B24B37/005; B24B37/04; B24B37/27; B24B49/04; (IPC1-7): B24B7/17; B24B37/04
Foreign References:
JPH10217074A1998-08-18
JPH1177497A1999-03-23
JPH09272049A1997-10-21
JPS6078236U1985-05-31
Other References:
See also references of EP 1118429A4
Attorney, Agent or Firm:
Yoshimiya, Mikio (Motoasakusa 2-chome Taito-ku, Tokyo, JP)
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