Title:
METHOD FOR DICING WAFER AND SYSTEM FOR DICING WAFER
Document Type and Number:
WIPO Patent Application WO/2019/022277
Kind Code:
A1
Abstract:
A method for dicing wafer according to one embodiment comprises the steps of: forming a pattern between a plurality of semiconductor elements formed on one surface of a wafer; and dicing the wafer into a plurality of semiconductor chips by irradiating a first plasma to etch the other surface of the wafer, wherein the step of forming the pattern may form a groove down to a certain depth of the wafer.
Inventors:
CHOI YONG SUP (KR)
OH JUNG KEUN (KR)
JEONG HYUN YOUNG (KR)
LEE JIN SEOK (KR)
OH JUNG KEUN (KR)
JEONG HYUN YOUNG (KR)
LEE JIN SEOK (KR)
Application Number:
PCT/KR2017/008214
Publication Date:
January 31, 2019
Filing Date:
July 31, 2017
Export Citation:
Assignee:
YEST CO LTD (KR)
International Classes:
H01L21/78; H01L21/304; H01L21/3065; H01L21/67; H01L21/76
Foreign References:
| JP2006186234A | 2006-07-13 | |||
| KR20060044756A | 2006-05-16 | |||
| KR101595916B1 | 2016-02-19 | |||
| US20160190010A1 | 2016-06-30 | |||
| JP2003179005A | 2003-06-27 |
Attorney, Agent or Firm:
MUHANN PATENT & LAW FIRM (KR)
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