Title:
METHOD FOR DIVIDING SEMICONDUCTOR WAFER
Document Type and Number:
WIPO Patent Application WO/2003/071591
Kind Code:
A1
Abstract:
When a semiconductor wafer (W) with circuits in many regions sectioned by streets into semiconductor chips each having a circuit, at least the circuit face of the semiconductor wafer (W) is covered with a masking member (15). The part of the masking member (15), which covers the top of the streets (S) is removed by irradiation with a laser beam. The semiconductor wafer (W) clear of the masking member (15) covering the top of the streets (S) is chemically etched to corrode the streets and thus divided into individual semiconductor chips (C). This method is economical and simple because of no need of a photomask or an aligner and because of no cuts of a semiconductor wafer and enables formation of high-quality chips free of cracks or stresses.
Inventors:
SEKIYA KAZUMA (JP)
Application Number:
PCT/JP2003/001235
Publication Date:
August 28, 2003
Filing Date:
February 06, 2003
Export Citation:
Assignee:
DISCO CORP (JP)
SEKIYA KAZUMA (JP)
SEKIYA KAZUMA (JP)
International Classes:
B23K26/40; B28D5/00; H01L21/00; H01L21/301; H01L21/308; H01L21/78; (IPC1-7): H01L21/301
Foreign References:
| JP2001144126A | 2001-05-25 | |||
| JP2001127011A | 2001-05-11 |
Attorney, Agent or Firm:
Sasaki, Isao (KAWAMURA & ASSOCIATES Toranomon Sangyo
Bldg. 6F 2-2, Toranomon 1-chome Minato-ku Tokyo, JP)
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