Title:
METHOD OF DRY-ETCHING RESIN FILM AND DEVICE THEREFOR
Document Type and Number:
WIPO Patent Application WO/2001/036181
Kind Code:
A1
Abstract:
Either one of laminate materials formed by laminating metal foils on a resin film element material and a resin film is used as an untreated material (F), a heating table (3) is brought into close contact with one-side surface and an etching opening pattern-formed mask (4) is brought into close contact with the opposite-side surface so as to sandwich the untreated material (F) therebetween, and the untreated material is gas-etched from the mask (4) side under a vacuum atmosphere with the close contact conditions maintained.
Inventors:
HAMANAKA RYOMYO (JP)
NAKANO YOSHIMASA (JP)
TAKEUCHI TATSUYA (JP)
FUKUMOTO SHINSUKE (JP)
NAKANO YOSHIMASA (JP)
TAKEUCHI TATSUYA (JP)
FUKUMOTO SHINSUKE (JP)
Application Number:
PCT/JP2000/007995
Publication Date:
May 25, 2001
Filing Date:
November 13, 2000
Export Citation:
Assignee:
TORAY ENG CO LTD (JP)
SHINKO SEIKI (JP)
HAMANAKA RYOMYO (JP)
NAKANO YOSHIMASA (JP)
TAKEUCHI TATSUYA (JP)
FUKUMOTO SHINSUKE (JP)
SHINKO SEIKI (JP)
HAMANAKA RYOMYO (JP)
NAKANO YOSHIMASA (JP)
TAKEUCHI TATSUYA (JP)
FUKUMOTO SHINSUKE (JP)
International Classes:
B29C59/14; H05K3/00; H01L21/311; (IPC1-7): B29C59/14; H05K3/00
Foreign References:
| US4545851A | 1985-10-08 | |||
| US4529860A | 1985-07-16 | |||
| JPH08134666A | 1996-05-28 | |||
| JPH05326457A | 1993-12-10 |
Attorney, Agent or Firm:
Ogawa, Shin-ichi (Toranomon 1-chome Minato-ku, Tokyo, JP)
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