Title:
METHOD OF ENABLING SELECTIVE AREA PLATING ON A SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2010/065301
Kind Code:
A3
Abstract:
A method of enabling selective area plating on a substrate (201) includes forming a first electrically conductive layer (310) on the substrate, covering the electrically conductive layer with an anti-electroless plating layer (410), patterning the substrate in order to form therein a feature (510, 520) extending through the anti-electroless plating layer and the first electrically conductive layer, forming a second electrically conductive layer (610) adjoining and electrically connected to the first electrically conductive layer, forming a third electrically conductive layer (710) over the second electrically conductive layer, and removing the anti-electroless plating layer and the first electrically conductive layer.
Inventors:
LI YONGGANG (US)
SALAMA ISLAM (US)
SALAMA ISLAM (US)
Application Number:
PCT/US2009/064898
Publication Date:
August 12, 2010
Filing Date:
November 18, 2009
Export Citation:
Assignee:
INTEL CORP (US)
LI YONGGANG (US)
SALAMA ISLAM (US)
LI YONGGANG (US)
SALAMA ISLAM (US)
International Classes:
H01L21/60
Foreign References:
| US7033648B1 | 2006-04-25 | |||
| US20060183309A1 | 2006-08-17 | |||
| KR100265771B1 | 2000-10-02 | |||
| KR100399910B1 | 2003-09-29 |
Attorney, Agent or Firm:
VINCENT, Lester J. et al. (1279 Oakmead ParkwaySunnyvale, California, US)
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