METHOD OF EVALUATING ADHERENCE, MATERIAL OF LOW ADHERENCE AND RESIN SHAPING DIE

Title:

METHOD OF EVALUATING ADHERENCE, MATERIAL OF LOW ADHERENCE AND RESIN SHAPING DIE

Document Type and Number:

WIPO Patent Application WO/2005/092587

Kind Code:

A1

Abstract:

Oxide (3) is present in die surface (6) for contact with fluid resin of upper die (1). The oxide (3) contains a metal cation and an ion. Field strength is computed from the valence of metal cation and the ionic radius of ion. Die release property between hardened resin and die surface (6) is evaluated on the basis of given relationship established between the value of field strength and the adhesion strength between hardened resin and die surface (6). Thus, the method of evaluating the die release property between hardened resin and die surface (6) is established. Material of high die release property (3) can be easily provided by the employment of this evaluation method. Further, resin shaping dies with excellent die release property can be obtained by the use of the material of high die release property (3) in the die surface (6) of upper die (1).

Inventors:

KUNO TAKAKI (JP)
MAEDA KEIJI (JP)
NOGUCHI YOSHINORI (JP)
KITAOKA SATOSHI (JP)
KAWASHIMA NAOKI (JP)
SUDA SEIICHI (JP)
YOSHIYA MASATO (JP)
YAMAGUCHI NORIO (JP)

Application Number:

PCT/JP2005/003577

Publication Date:

October 06, 2005

Filing Date:

March 03, 2005

Export Citation:

Click for automatic bibliography generation Help

Assignee:

TOWA CORP (JP)
JAPAN FINE CERAMICS CT (JP)
KUNO TAKAKI (JP)
MAEDA KEIJI (JP)
NOGUCHI YOSHINORI (JP)
KITAOKA SATOSHI (JP)
KAWASHIMA NAOKI (JP)
SUDA SEIICHI (JP)
YOSHIYA MASATO (JP)
YAMAGUCHI NORIO (JP)

International Classes:

B29C33/38; G01N19/04; (IPC1-7): B29C33/38; G01N19/04

Foreign References:

JPH0338314A	1991-02-19
JPS60103078A	1985-06-07
JPH1165211A	1999-03-05
JPH05215668A	1993-08-24

Other References: