Title:
METHOD FOR FABRICATING ARRAY SUBSTRATE, ARRAY SUBSTRATE, AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/203501
Kind Code:
A1
Abstract:
A method for fabricating an array substrate, an array substrate, and a display device. The method for fabricating an array substrate comprises: providing a first pad (22) on a substrate (10), and providing a first through hole (31), which exposes the first pad (22), on a first insulative layer (30) so that a second pad (53) is connected to the first pad (22) by means of the first through hole (31), thereby increasing the thickness of the pads.
Inventors:
ZHAO BIN (CN)
ZHAO RUI (CN)
LI JIA (CN)
ZHAO RUI (CN)
LI JIA (CN)
Application Number:
PCT/CN2020/088957
Publication Date:
October 14, 2021
Filing Date:
May 07, 2020
Export Citation:
Assignee:
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD (CN)
International Classes:
H01L21/77; H01L27/12; H01L27/15
Foreign References:
US20170301724A1 | 2017-10-19 | |||
CN105870265A | 2016-08-17 | |||
CN110471219A | 2019-11-19 | |||
JP2015050308A | 2015-03-16 | |||
CN110416248A | 2019-11-05 | |||
CN101051472A | 2007-10-10 |
Attorney, Agent or Firm:
PURPLEVINE INTELLECTUAL PROPERTY (SHENZHEN) CO., LTD. (CN)
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